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Welfare Printed Circuits Board Co.,Ltd.
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Welfare Printed Circuits Board Factory was established in May, 1991, located in Hongxing Industrial Zone, Songgang, Bao'an, Shenzhen, China. Our father company is Welfare Printed Circuits Board Co., Ltd., which was established in Hong Kong in 1984. In Oct. 2009, we invested in at least 100 million HK dollars to build our new factory - Welfare (Kai Ping) Electronics Products Ltd. The factory will start operation at the end of 2010. At present, our factory occupies an area of 20,000 square meters with around 1200 employees. We have 5 advanced product lines and 1 auto-product line, which are capable of providing a capacity of 75,000 in one shift to 150,000 square meters of boards in two shifts,...

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Immersion Au Board 4-Layer

Immersion Au Board 4-Layer

Technical Discription:
Layer:2
Material: FR-4
Board thicknee: 0.8mm
Copper thickness:1/1
Surface treatment: Immersion A...

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OSP Board 4-Layer

OSP Board 4-Layer

Technical Discription:
Layer:4
Material: FR-4
Board thicknee: 1.6mm
Copper thickness:H/H
Surface treatment: OSP
Min li...

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Immersion Au multilayer pcb

Immersion Au multilayer pcb

Layer:4
Material: FR-4
Board thicknee: 0.8mm
Copper thickness:H/1/1/H
Surface treatment: Immerson Au
Min line spacing/w...

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Immersion Au multilayer pcb

Immersion Au multilayer pcb

Layer:4
Material: FR-4
Board thicknee: 1.0mm
Copper thickness:H/1/1/H
Surface treatment: Immersion Au
Min line spacing/...

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multilayer osp pcb

multilayer osp pcb

Layer:4
Material: FR-4
Board thicknee: 1.1m
Copper thickness:H/H/H/H
Surface treatment: osp
Min line spacing/width:0.1m...

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OSPBoard 2-Layer

OSPBoard 2-Layer

Laminate: CEM-3, 1.6mm, 1/1oz
Layer: 2-L
Min width/space: 0.3mm/0.3mm
Min Hole: 0.5mm

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OSP Board 2-Layer

OSP Board 2-Layer

Technical Discription:
Layer:2
Material: FR-4
Board thicknee: 0.35mm
Copper thickness:H/H
Surface treatment: OSP
Min l...

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Immersion Au board

Immersion Au board

Layer:2
Material: FR-4
Board thicknee: 1.6mm
Copper thickness:H/H
Surface treatment: Immersion Au
Min line spacing/widt...

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HAL Board 2-layer

HAL Board 2-layer

Layer:2
Material: CEM-3
Board thicknee: 1.1mm
Copper thickness:H/H
Surface treatment: HAL
Min line spacing/width:0.30mm...

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OSP Board 1-Layer

OSP Board 1-Layer

Technical Discription:
Layer:1
Material: FR-4
Board thicknee: 1.2mm
Copper thickness:1/0
Surface treatment: OSP
Min li...

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single side osp board

single side osp board

Layer:1
Material: CEM-1
Board thicknee: 1.6mm
Copper thickness:1/0
Surface treatment: osp
Min line spacing/width:0.25mm...

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Double sides 2-layer

Double sides 2-layer

Layer:2
Material: FR-4
Board thicknee: 2.0mm
Copper thickness:H/H
Surface treatment: osp
Min line spacing/width:0.20mm/...

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